carnival W proto
carnival W proto
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$5.50 AUD
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carnival W boards for surface mount prototyping.
carnival W boards are a wider version of carnival A. carnival W suits 300 mil wide SOIC packages such as SOIC-{18,20,24}, as well as hexapod crowns.
carnival prototyping boards have a 4-layer design where the central pads are connected through to the back side of the board using vias-in-pads PCB fabrication technology. Once an IC is soldered to the front of the board, the matching pads on the back make it easy to route signals to through-hole connections on the left and right. carnival boards also have top-bottom connectivity via opposing teeth. carnival boards are good for logic and microcontroller circuits where a large fraction of the IC pins will be connected to through-hole headers.
Use the carnival W design template (PDF) to layout your circuits.
part number | HXP-CAW2-G-MG |
board size | 70 x 40 x 1.6mm |
surface finish | ENIG |
solder mask color | matte green |
through-hole spacing | 100 mil (2.54mm) |
central pad pitch (center to center) | 50 mil (1.27mm) |
central pad gap (copper to copper) | 12 mil (0.305mm) |
PCB only. The other components shown in examples are not included.
Also shown is the crown QFP32 0.8mm adapter to connect the QFP microcontroller package, an Atmel ATSAMD21E18A.
Also shown is the crown QFP32 0.8mm adapter to connect the QFP microcontroller package, an Atmel ATSAMD21E18A.





