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crown QFP32 0.8mm

crown QFP32 0.8mm

Regular price $12.30 AUD
Regular price Sale price $12.30 AUD
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QFP32 0.8mm pitch to SOIC format chip carrier.

Sold in packs of 5.

hexapod crown QFP32 0.8mm adapts QFP32 and QFN16 packages with pin pitch 0.8mm to the standard 50mil SOIC format. These adapters are intended to be soldered to a larger host board, such as carnival W proto and ritual W proto. The W (wide) versions of these host boards must be used for the crown to fit.

The crown also provides distribution pads connected to each of the pin landings on the QFP footprint. These distribution pads can be used to host decoupling capacitors and pull-up/pull-down resistors on the crown board itself, rather than using space on the host board. 

On the upper and lower perimiters the central casselated notches connect to the ground plane on the underside of the board. The ground plane is in turn connected to the ground pad in the center of the footprint, and the vertical ground pads running along the extreme left and right of the crown. An extra notch on each of the corners is provided to make it easy to route power and ground to the distribution pads.

The crown QFP32 0p8 design template (PDF) describes the pad connections and can be used to layout your circuits.

part number HXP-KQA1-G-MG
board size 25.2 x 12.7 x 0.8mm
surface finish ENIG
solder mask color matte green
casselated hole pitch 50 mil (1.27mm)
QFP32 footprint pad pitch 0.8mm

PCB only. The other components shown in examples are not included.
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