Crown KQA QFP32 0.8mm
Crown KQA QFP32 0.8mm
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$12.30 AUD
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$12.30 AUD
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Hexapod Crown KQA is QFP32 0.8mm pitch to SOIC adapter board.
Hexapod Crown KQA adapts QFP32 and QFN16 packages with 0.8mm lead pitch to the standard 50mil SOIC format. These adapters are intended to be soldered to a larger host board, such as Carnival W proto and Ritual W proto. The W (wide) versions of these host boards must be used for the crown to fit.
The crown also provides distribution pads connected to each of the pin landings on the QFP footprint. These distribution pads can be used to host decoupling capacitors and pull-up/pull-down resistors on the crown board itself, rather than using space on the host board.
On the upper and lower perimeters the central castellated notches connect to the ground plane on the underside of the board. The ground plane is in turn connected to the ground pad in the center of the footprint, and the vertical ground pads running along the extreme left and right of the crown. An extra notch on each of the corners is provided to make it easy to route power and ground to the distribution pads.
The crown also provides distribution pads connected to each of the pin landings on the QFP footprint. These distribution pads can be used to host decoupling capacitors and pull-up/pull-down resistors on the crown board itself, rather than using space on the host board.
On the upper and lower perimeters the central castellated notches connect to the ground plane on the underside of the board. The ground plane is in turn connected to the ground pad in the center of the footprint, and the vertical ground pads running along the extreme left and right of the crown. An extra notch on each of the corners is provided to make it easy to route power and ground to the distribution pads.
The Crown QFP32 0p8 design template (PDF) describes the pad connections and can be used to layout your circuits.
Sold in packs of 5.
| part number | HXP-KQA1-G-MG |
| board size | 25.2 x 12.7 x 0.8mm |
| surface finish | ENIG |
| solder mask color | matte green |
| casselated hole pitch | 50 mil (1.27mm) |
| QFP32 footprint pad pitch | 0.8mm |
PCB only. The other components shown in examples are not included.
