festival A proto

festival A boards for surface mount prototyping.

festival A boards use an enhanced form of the ritual design, where four separate signal lines run along the top and bottom of the board. Signal lines are selected by soldering a short (2mm) piece of uninsulated wire from the signal pad to an adjacent distribution pad. This rich cross-board connectivity allows circuits to be build up in connected modules without needing jumper wires crossing left and right over the board.

Use the festival A design template (PDF) to layout your circuits.

part number	HXP-FAA1-G-MG
board size	70 x 30 x 1.6mm
surface finish	ENIG
solder mask color	matte green
through hole spacing	100 mil (2.54mm)
central pad pitch (center to center)	50 mil (1.27mm)
central pad gap (copper to copper)	12 mil (0.305mm)

PCB only. The other components shown in examples are not included.