bones KA protoboard

Hexapod Bones protoboards are designed for hybrid through-hole / surface mount prototyping.

Bones KA prototyping boards provide the common 100x100 mil through-hole grid interleaved with a second offset grid. The two grids combined support common 100 mil pitch through-hole components such as switches and potentiometers, along with 50 mil pitch surface mount components. The smaller plated vias on the offset 50 mil grid are connected vertically across the board in bread-board style, for easy connection to SOIC/SOP format devices.

Use the bones KA design template (PDF) to layout your circuits.

part number	HXP-BKA1-G-MG
board size	70 x 30 x 1.6mm
surface finish	ENIG
solder mask color	matte green
through-hole spacing	100 mil (2.54mm)

PCB only. The other components shown in examples are not included.